The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Oct. 02, 2014
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Assignee:
Toray Industríes, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/18 (2006.01); B32B 27/04 (2006.01); C08K 5/523 (2006.01); C08G 59/50 (2006.01); C08J 5/24 (2006.01); C08K 3/02 (2006.01); C08K 7/06 (2006.01); C09C 1/00 (2006.01); B32B 5/26 (2006.01); B32B 27/08 (2006.01); B32B 27/38 (2006.01); C08K 9/02 (2006.01);
U.S. Cl.
CPC ...
C08K 5/523 (2013.01); B32B 5/26 (2013.01); B32B 27/08 (2013.01); B32B 27/38 (2013.01); C08G 59/50 (2013.01); C08G 59/5006 (2013.01); C08G 59/5033 (2013.01); C08J 5/24 (2013.01); C08K 3/02 (2013.01); C08K 7/06 (2013.01); C08K 9/02 (2013.01); C09C 1/00 (2013.01); B32B 2250/02 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/106 (2013.01); B32B 2439/00 (2013.01); B32B 2457/00 (2013.01); C01P 2004/61 (2013.01); C01P 2004/62 (2013.01); C08K 2003/026 (2013.01); Y10T 428/1362 (2015.01); Y10T 428/1372 (2015.01); Y10T 428/24994 (2015.04); Y10T 428/24995 (2015.04); Y10T 428/249952 (2015.04); Y10T 428/25 (2015.01); Y10T 428/263 (2015.01); Y10T 428/269 (2015.01); Y10T 428/31511 (2015.04);
Abstract
The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: