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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9963541 B1

PDFFull Text
Date of Patent:
May. 08, 2018

Filed:

Jan. 27, 2015

Photosensitive resin composition for optical waveguide, photocurable film for formation of optical waveguide core layer, optical waveguide produced by using the resin composition or the photocurable film, and hybrid flexible printed wiring board for optical/electrical transmission

Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Tomoyuki Hirayama, Ibaraki, JP;

Naoya Sugimoto, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Osaka, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Michelle R Connelly

Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/138 (2006.01); C08G 59/32 (2006.01); C08G 59/38 (2006.01); C09D 163/00 (2006.01); C09D 171/00 (2006.01); G02B 6/10 (2006.01); C08L 63/00 (2006.01); C08G 59/40 (2006.01); C08G 65/22 (2006.01); G02B 6/122 (2006.01); C08G 59/24 (2006.01); C08G 59/68 (2006.01); C08G 65/18 (2006.01);
U.S. Cl.
CPC ...
C08G 59/3218 (2013.01); C08G 59/24 (2013.01); C08G 59/38 (2013.01); C08G 59/4007 (2013.01); C08G 59/687 (2013.01); C08G 65/18 (2013.01); C08G 65/22 (2013.01); C08L 63/00 (2013.01); C09D 163/00 (2013.01); C09D 171/00 (2013.01); G02B 6/10 (2013.01); G02B 6/12 (2013.01); G02B 6/1221 (2013.01); G02B 6/138 (2013.01); G02B 2006/1219 (2013.01);
Abstract

According to the present invention, a photosensitive resin composition for an optical waveguide contains a resin component and a photopolymerization initiator. The resin component has an absorbance of less than 0.03 as measured at 2960 cmby an attenuated total reflection measurement (ATR) method by means of a Fourier transform infrared spectrophotometer (FT-IR), and includes a polymerizable substituent-containing resin as a main component. Where the inventive optical waveguide photosensitive resin composition is used as a material for the optical waveguide, particularly as a core layer formation material for the optical waveguide, it is possible to reduce a loss, for example, by avoiding vibrational absorption occurring at an optical waveguide transmission light wavelength of 850 nm due to a resin skeleton.

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