The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Apr. 14, 2014
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Jean-Marc Martin Gerard Jouanno, Painted Post, NY (US);

Kiat Chyai Kang, Painted Post, NY (US);

Sue Camille Lewis, Webster, NY (US);

Govindarajan Natarajan, Poughkeepsie, NY (US);

Yu Xiao, Pittsford, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); C03B 27/012 (2006.01); B32B 17/06 (2006.01); B32B 17/10 (2006.01); B32B 37/06 (2006.01); B32B 37/08 (2006.01); B32B 37/10 (2006.01); B29C 44/06 (2006.01); B29C 35/02 (2006.01); B29C 44/24 (2006.01); B29C 43/30 (2006.01); B29C 43/52 (2006.01);
U.S. Cl.
CPC ...
C03B 27/012 (2013.01); B32B 17/061 (2013.01); B32B 17/064 (2013.01); B32B 17/10036 (2013.01); B32B 37/06 (2013.01); B32B 37/08 (2013.01); B32B 37/10 (2013.01); B29C 35/0238 (2013.01); B29C 35/0277 (2013.01); B29C 43/30 (2013.01); B29C 43/52 (2013.01); B29C 44/06 (2013.01); B29C 44/24 (2013.01); B32B 2457/20 (2013.01);
Abstract

A method of forming a laminated glass structure includes introducing a continuous ribbon of flexible glass substrate having a thickness of no greater than about 0.3 mm to a substrate material. The substrate material has a coefficient of thermal expansion (CTE) that is greater than that of the flexible glass substrate. The flexible glass substrate is laminated to the substrate material at an elevated temperature. The substrate material is cooled to introduce a compressive stress across a thickness of the flexible glass substrate.


Find Patent Forward Citations

Loading…