The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

May. 19, 2015
Applicant:

Rosemount Aerospace Inc., Burnsville, MN (US);

Inventors:

David P. Potasek, Lakeville, MN (US);

Robert Stuelke, Minneapolis, MN (US);

Assignee:

Rosemount Aerospace, Inc., Burnsville, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0058 (2013.01); B81B 7/0048 (2013.01); B81B 2207/015 (2013.01); H01L 2224/48247 (2013.01);
Abstract

A sensor package includes a manifold and a MEMS die. The manifold includes a cylindrical body, a flange, and a mounting surface. The cylindrical body defines a first passage that extends longitudinally along a central axis from a first exterior end to an interior end of the cylindrical body. The flange extends from the cylindrical body and has an outer periphery that is configured to support a print circuit board. The mounting surface is disposed at the interior end of the first passage. The surface area of the mounting surface is less than the surface area of a MEMS die configured to mate with the mounting surface.


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