The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9963339 B1

Date of Patent:

May. 08, 2018

Filed:

Mar. 07, 2017

Sensor device

Applicant:

Alps Electric Co., Ltd., Ota-ku, Tokyo, JP;

Inventors:

Eiji Umetsu, Niigata-ken, JP;

Hisanobu Okawa, Niigata-ken, JP;

Assignee:

Alps Electric Co., Ltd., Tokyo, JP;

Attorney:

Beyer Law Group LLP

Primary Examiner:

Eduardo A Rodela

Int. Cl.

CPC ...

B81B 3/00 (2006.01); B81B 7/00 (2006.01); G01D 5/24 (2006.01); G01D 5/16 (2006.01);

U.S. Cl.

CPC ...

B81B 3/0021 (2013.01); B81B 3/00 (2013.01); B81B 3/0018 (2013.01); B81B 3/0067 (2013.01); B81B 7/007 (2013.01); B81B 7/0016 (2013.01); B81B 7/0058 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); G01D 5/16 (2013.01); G01D 5/24 (2013.01);

Abstract

A sensor device includes: a sensor portion having a movable thin film and a detection element configured to output a signal corresponding to displacement of the movable thin film; a frame portion disposed to surround an outside of the sensor portion; a spring portion provided between the frame portion and the sensor portion; and a circuit board including a circuit configured to process the signal output from the detection element, in which the frame portion is laminated on the circuit board, and the sensor portion is cantilevered from the frame portion by the spring portion such that a gap is formed between the sensor portion and the circuit board.

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