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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9962908 B1

PDFFull Text
Date of Patent:
May. 08, 2018

Filed:

Apr. 09, 2013

Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate

Applicants:

Tadatomo Suga, Nakano-ku, JP;

Lan Technical Service Co., Ltd., Shinjuku-ku, JP;

Inventors:

Tadatomo Suga, Nakano-ku, JP;

Yoshiie Matsumoto, Shinjuku-ku, JP;

Assignee:

LAN TECHNICAL SERVICE CO., LTD., Shinjuku-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Daniel McNally

Int. Cl.
CPC ...
B32B 15/08 (2006.01); B29C 65/14 (2006.01); B29C 65/00 (2006.01); C08J 5/12 (2006.01); B29C 59/14 (2006.01); B32B 15/09 (2006.01); B32B 27/28 (2006.01); B32B 27/36 (2006.01); B32B 37/24 (2006.01); B32B 38/00 (2006.01); B32B 27/08 (2006.01); B32B 17/06 (2006.01); B32B 37/18 (2006.01); B32B 37/20 (2006.01); B32B 37/02 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); B29C 59/14 (2013.01); B29C 65/1432 (2013.01); B29C 65/1467 (2013.01); B29C 66/028 (2013.01); B29C 66/1122 (2013.01); B29C 66/45 (2013.01); B29C 66/72321 (2013.01); B29C 66/72325 (2013.01); B29C 66/7373 (2013.01); B29C 66/74 (2013.01); B29C 66/8221 (2013.01); B29C 66/83241 (2013.01); B29C 66/83413 (2013.01); B32B 15/09 (2013.01); B32B 17/064 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 27/36 (2013.01); B32B 37/24 (2013.01); B32B 38/00 (2013.01); C08J 5/12 (2013.01); B29C 66/71 (2013.01); B29C 66/712 (2013.01); B29C 66/72326 (2013.01); B29C 66/7392 (2013.01); B29C 66/7394 (2013.01); B29C 66/73921 (2013.01); B29C 66/73941 (2013.01); B29C 66/7461 (2013.01); B29C 66/7465 (2013.01); B29C 66/74611 (2013.01); B32B 37/0076 (2013.01); B32B 37/02 (2013.01); B32B 37/182 (2013.01); B32B 37/203 (2013.01); B32B 2037/0092 (2013.01); B32B 2037/243 (2013.01); B32B 2250/03 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2255/205 (2013.01); B32B 2307/546 (2013.01); B32B 2309/68 (2013.01); B32B 2310/0881 (2013.01); B32B 2457/20 (2013.01); B32B 2457/206 (2013.01); Y10T 156/10 (2015.01); Y10T 428/31681 (2015.04);
Abstract

The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S) for forming a first inorganic material layer on part or all of a first polymer film; a step (S) for forming a second inorganic material layer on part or all of a second polymer film; a step (S) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.

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