The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Mar. 28, 2014
Applicant:
Shinsei Kagaku Kogyo Co., Ltd., Shiga, JP;
Inventors:
Assignee:
SHINSEI KAGAKU KOGYO CO., LTD., Shiga, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29K 705/10 (2006.01); B29K 81/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14311 (2013.01); B29K 2081/00 (2013.01); B29K 2081/04 (2013.01); B29K 2705/10 (2013.01); B29K 2995/0005 (2013.01); B29K 2995/0007 (2013.01);
Abstract
An insert molding method includes: integrally molding a thermoplastic resin with an insert component, by setting the insert component, which is a metal conductor, in a mold; clamping the mold; and injection-filling the thermoplastic resin in a cavity. The insert component is made of copper or a copper alloy. Prior to injection molding, a thin film layer mainly made of a chlorosulfonated polyethylene is formed on a surface of a portion of the insert component to be covered with the thermoplastic resin, and the thin film layer is crosslinked in the mold during injection molding.