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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9961793 B1

PDFFull Text
Date of Patent:
May. 01, 2018

Filed:

Nov. 17, 2016

Modular electronic device with improved retention/release features and related assembly methods

Applicant:

Google Inc., Mountain View, CA (US);

Inventors:

Jason Cinge Wong, Millbrae, CA (US);

Jason Okamoto, Irvine, CA (US);

Alvin Alza Dominguez, Union City, CA (US);

Brett Mateo, Union City, CA (US);

Assignee:

Google Inc., Mountain View, CA (US);

Attorney:

Dority & Manning, P.A.

Primary Examiner:

Hung S Bui

Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/02 (2006.01); H01R 12/73 (2011.01); H01R 12/79 (2011.01); H01R 43/26 (2006.01); H05K 7/14 (2006.01); H05K 9/00 (2006.01); H05K 13/00 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/026 (2013.01); H01R 12/732 (2013.01); H01R 12/79 (2013.01); H01R 43/26 (2013.01); H05K 1/028 (2013.01); H05K 1/14 (2013.01); H05K 7/1401 (2013.01); H05K 9/0022 (2013.01); H05K 13/0023 (2013.01); H05K 2201/04 (2013.01);
Abstract

An electronic module for a modular electronic device may include improved features for retaining the electronic module relative a frame of the modular electronic device and/or for subsequently removing such module from the frame. In addition, aspects of the present subject matter related to improved methods for assembling an electronic module for use with a modular electronic device.

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Quick Actions:

Wong, Jason. (2018). Modular electronic device with improved retention/release features and related assembly methods (U.S. Patent No. 9961793). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9961793

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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