The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Nov. 15, 2013
Applicant:

Osram Gmbh, Munich, DE;

Inventors:

Thomas Preuschl, Sinzing, DE;

Robert Kraus, Regensburg, DE;

Assignee:

OSRAM GMBH, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01); F21V 3/02 (2006.01); F21V 19/00 (2006.01); F21V 23/00 (2015.01); F21K 9/20 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H05K 3/341 (2013.01); F21K 9/20 (2016.08); F21V 3/02 (2013.01); F21V 19/001 (2013.01); F21V 23/006 (2013.01); H05K 3/36 (2013.01); F21Y 2115/10 (2016.08); Y10T 29/49128 (2015.01);
Abstract

An optoelectronic assembly may include a substrate, which has a first contact region at a first side thereof, an optoelectronic component arranged on the first side of the substrate, which has a first contact coupled to the first contact region, a printed circuit board with conductor tracks, which is coupled to the first side of the substrate at a first side of the printed circuit board and which has a central cutout, in which the optoelectronic component is exposed, and which has a first contact cutout, which overlaps the first contact region, at least one electronic component arranged on a second side of the printed circuit board, which is coupled to the conductor tracks, and a connection element, which is arranged in the first contact cutout and electrically couples the first contact region to the conductor tracks, wherein the connection element fixes the substrate to the printed circuit board.


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