The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9961779 B1

PDF
Full Text
Expired
Date of Patent:
May. 01, 2018

Filed:

Dec. 10, 2013
Applicant:

Continental Teves Ag & Co. Ohg, Frankfurt, DE;

Inventors:

Lothar Biebricher, Oberursel, DE;

Michael Schulmeister, Groβ-Zimmern, DE;

Jakob Schillinger, Gaimersheim, DE;

Dietmar Huber, Rödermark, DE;

Thomas Fischer, Frankfurt am Main, DE;

Stefan Günthner, Frankfurt am Main, DE;

Waldemar Baumung, Pfungstadt, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/30 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H05K 3/30 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/562 (2013.01); H05K 1/186 (2013.01); H01L 23/495 (2013.01); H01L 23/552 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); Y10T 29/49147 (2015.01);
Abstract

A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: —arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and —encapsulating the electronic component with the encapsulation material.


Find Patent Forward Citations

Biebricher, Lothar. (2018). Method for producing an electronic assembly (U.S. Patent No. 9961779). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9961779

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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