The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2018
Filed:
Oct. 30, 2015
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Masaru Takahashi, Nagaokakyo, JP;
Choichiro Fujii, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A built-in-electronic-component substrate includes a core substrate, an electronic component mounted on one main surface of the core substrate via a joining member, and a resin layer including the electronic component embedded therein. The electronic component is a multilayer ceramic capacitor including a ceramic multilayer body, and a first outer electrode including an end surface portion and a second outer electrode including an end surface portion provided on end surfaces of the ceramic multilayer body. A first gap is provided between the resin layer and the end surface portion of the first outer electrode and the joining member and a second gap is provided between the resin layer and the end surface portion of the second outer electrode and the joining member.