The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2018
Filed:
Jan. 18, 2017
Silicon Works Co., Ltd., Daejeon-si, KR;
Ju Young Shin, Daejeon, KR;
Jung Bae Yun, Daejeon-si, KR;
Yong Jung Kwon, Cheongju-si, KR;
Jeung Hie Choi, Cheongju-si, KR;
SILICON WORKS CO., LTD., Daejeon-si, KR;
Abstract
The present invention relates to a circuit board for COF (Chip on Film) package, which is capable of preventing an influence of coupling noise on a core block of an integrated circuit. The circuit board may include: a base film defined a core block region overlapping a predetermined location of a core block within an integrated circuit and having the same area as or larger area than the core block; first routing patterns formed on the base film; and a first block pattern covering the core block region. The first routing patterns may be formed outside the first block pattern at the same layer as the first block pattern.