The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Dec. 10, 2015
Applicant:

Skullcandy, Inc., Park City, UT (US);

Inventor:

Peter M. Kelly, Park City, UT (US);

Assignee:

Skullcandy, Inc., Park City, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/10 (2006.01);
U.S. Cl.
CPC ...
H04R 1/1066 (2013.01); H04R 1/1016 (2013.01); B60B 2310/321 (2013.01); H04R 1/1058 (2013.01); H04R 2201/025 (2013.01);
Abstract

In-ear headphone assemblies and related methods are disclosed. An in-ear headphone assembly includes a rigid shell, a rigid nozzle, and a resilient overmold structure permanently molded to the rigid nozzle and the rigid shell. The resilient overmold structure secures a proximal end of the rigid nozzle proximate to a first side of the rigid shell defining a sound aperture. The resilient overmold structure defines a sound passage acoustically coupling a volume defined by the rigid shell to a sound channel of the rigid nozzle through the sound aperture and the proximal end of the rigid nozzle. A method of manufacturing a headphone assembly includes positioning the rigid nozzle and the rigid shell within a cavity of a mold, and injecting a polymer or polymer precursor material into the cavity of the mold.


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