The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Jun. 26, 2015
Applicant:

Flir Systems, Inc., Wilsonville, OR (US);

Inventors:

Theodore R. Hoelter, Goleta, CA (US);

Mark Nussmeier, Goleta, CA (US);

Eric A. Kurth, Santa Barbara, CA (US);

Nicholas Högasten, Santa Barbara, CA (US);

Katrin Strandemar, Rimbo, SE;

Pierre Boulanger, Goleta, CA (US);

Barbara Sharp, Santa Barbara, CA (US);

Assignee:

FLIR Systems, Inc., Wilsonville, OR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/33 (2006.01); H04N 5/225 (2006.01); G01J 5/04 (2006.01); H01L 27/146 (2006.01); G01J 5/06 (2006.01); G01J 5/08 (2006.01); G01J 5/20 (2006.01); H04N 5/365 (2011.01); G01J 5/02 (2006.01); G01J 5/00 (2006.01);
U.S. Cl.
CPC ...
H04N 5/33 (2013.01); G01J 5/025 (2013.01); G01J 5/027 (2013.01); G01J 5/0265 (2013.01); G01J 5/04 (2013.01); G01J 5/061 (2013.01); G01J 5/0881 (2013.01); G01J 5/20 (2013.01); H01L 27/14618 (2013.01); H01L 27/14683 (2013.01); H04N 5/2257 (2013.01); H04N 5/332 (2013.01); H04N 5/3655 (2013.01); H04N 5/3656 (2013.01); G01J 2005/0077 (2013.01); G01J 2005/202 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01);
Abstract

In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly, including a substrate, a microbolometer array disposed on an upper surface of the substrate; and a cap disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base is disposed below the substrate, and a heat spreader having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.


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