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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9960475 B1

PDFFull Text
Date of Patent:
May. 01, 2018

Filed:

Oct. 28, 2015

Led lighting device and system, and antenna arrangement method

Applicant:

Sengled Optoelectronics Co., Ltd., Tongxiang, CN;

Inventors:

Xiaofei Chen, Tongxiang, CN;

Xingming Deng, Tongxiang, CN;

Jinxiang Shen, Tongxiang, CN;

Assignee:

SENGLED OPTOELECTRONICS CO., LTD., Tongxiang, CN;

Attorney:

Anova Law Group, PLLC

Primary Examiner:

Douglas W Owens

Assistant Examiner:

Pedro C Fernandez

Int. Cl.
CPC ...
H01Q 1/22 (2006.01); F21V 3/00 (2015.01); F21V 23/04 (2006.01); F21V 29/503 (2015.01); F21K 9/232 (2016.01); F21V 29/74 (2015.01); F21K 9/238 (2016.01); F21K 9/237 (2016.01); F21V 1/00 (2006.01); F21V 23/02 (2006.01); H01Q 1/00 (2006.01); H05B 37/02 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01Q 1/22 (2013.01); F21K 9/232 (2016.08); F21K 9/237 (2016.08); F21K 9/238 (2016.08); F21V 1/00 (2013.01); F21V 3/00 (2013.01); F21V 23/02 (2013.01); F21V 23/0435 (2013.01); F21V 29/503 (2015.01); F21V 29/74 (2015.01); H01Q 1/007 (2013.01); H05B 37/0272 (2013.01); F21Y 2115/10 (2016.08);
Abstract

A light emitting diode (LED) lighting device is provided. The device includes an LED light source assembly installed on the top of a heat sink body, and an LED driving and power supply unit configured to drive the LED light source assembly and provide electrical power for the LED lighting device. The device also includes a heat sink including the heat sink body and a heat sink covering, where the heat sink covering has an opening; and a plane including the highest point of the top of the heat sink body is higher than a plane including the opening of the heat sink covering. Further, the device includes a radio frequency (RF) antenna installed on periphery of the heat sink body. A plane that includes the highest point of the RF antenna is at the same level or lower than the plane that includes the highest point of the top of the heat sink body.

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