The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

May. 13, 2016
Applicant:

Wuhan China Star Optoelectronics Technology Co., Ltd., Wuhan, CN;

Inventor:

Hong Fang, Wuhan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 51/00 (2006.01); H01L 21/683 (2006.01); H01L 51/56 (2006.01); C25B 1/04 (2006.01); C25B 11/03 (2006.01); B32B 43/00 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); B32B 43/006 (2013.01); C25B 1/04 (2013.01); C25B 11/035 (2013.01); H01L 21/6835 (2013.01); H01L 51/003 (2013.01); H01L 51/56 (2013.01); H01L 27/3244 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68381 (2013.01); H01L 2227/323 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01);
Abstract

The present invention provides a stripping method of a flexible substrate, comprising: providing a porous metal substrate; forming a buffer layer on the porous metal substrate; forming a flexible substrate on the buffer layer; putting the flexible substrate in the electrolytic tank so that the part of the porous metal substrate is immersed in the electrolyte, and the porous metal substrate is employed to be a cathode electrified to electrolyze water in the electrolyte, and the porous metal substrate will releases the hydrogen, and the flexible substrate and the buffer layer are stripped from the porous metal substrate with the acting force of the hydrogen to obtain the flexible substrate with the buffer layer at the bottom. The method is high efficient and without damaging to promote the production yield of the flexible substrate.


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