The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

May. 17, 2017
Applicant:

Alpad Corporation, Chiyoda-ku, JP;

Inventors:

Susumu Obata, Nonoici, JP;

Akihiro Kojima, Nonoici, JP;

Assignee:

ALPAD CORPORATION, Chiyoda-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/36 (2010.01); H01L 33/38 (2010.01); H01L 33/40 (2010.01); H01L 33/00 (2010.01); H01L 33/20 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/38 (2013.01); H01L 33/36 (2013.01); H01L 33/385 (2013.01); H01L 33/40 (2013.01); H01L 33/0079 (2013.01); H01L 33/20 (2013.01); H01L 33/505 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0066 (2013.01);
Abstract

According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first metal pillar, a second metal pillar, and an insulating layer. The semiconductor layer includes a first surface, a second surface, and a light emitting layer. The first metal pillar is electrically connected to the second surface. The first metal pillar includes first and second metal layers. The first metal layer is provided between the second surface and at least a part of the second metal layer. The second metal pillar is arranged side by side with the first metal pillar, and electrically connected to the second surface. The second metal pillar includes third and fourth metal layers. The third metal layer is provided between the second surface and at least a part of the fourth metal layer. The insulating layer is provided between the first and second metal pillars.


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