The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2018
Filed:
Sep. 26, 2014
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventors:
Hideyuki Sagawa, Naka-gun, JP;
Keisuke Fujito, Mito, JP;
Takayuki Tsuji, Kitaibaraki, JP;
Hiromitsu Kuroda, Hitachi, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0224 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); C22C 13/00 (2006.01); C22C 9/00 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01); C23C 10/28 (2006.01);
U.S. Cl.
CPC ...
H01L 31/022425 (2013.01); B23K 35/0222 (2013.01); B23K 35/0227 (2013.01); B23K 35/0238 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/30 (2013.01); B23K 35/302 (2013.01); B23K 35/36 (2013.01); B23K 35/3602 (2013.01); C22C 9/00 (2013.01); C22C 13/00 (2013.01); C23C 10/28 (2013.01); C23C 28/021 (2013.01); Y02B 10/12 (2013.01); Y02E 10/50 (2013.01); Y10T 428/1266 (2015.01);
Abstract
A solder joint material includes a copper-based metal material including mainly a copper, a surface-treated layer that is provided on the copper-based metal material and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper, and a Sn-based solder plating layer provided on the surface-treated layer.