The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Apr. 13, 2015
Applicant:

Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);

Inventors:

Xiaobin Wang, San Jose, CA (US);

Anup Bhalla, San Jose, CA (US);

Hamza Yilmaz, Saratoga, CA (US);

Daniel Ng, Campbell, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/40 (2006.01); H01L 29/78 (2006.01); H01L 21/762 (2006.01); H01L 29/06 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/04 (2006.01);
U.S. Cl.
CPC ...
H01L 29/407 (2013.01); H01L 21/76205 (2013.01); H01L 29/0638 (2013.01); H01L 29/0649 (2013.01); H01L 29/66727 (2013.01); H01L 29/66734 (2013.01); H01L 29/7803 (2013.01); H01L 29/7811 (2013.01); H01L 29/7813 (2013.01); H01L 29/04 (2013.01); H01L 29/0619 (2013.01); H01L 29/0696 (2013.01); H01L 29/402 (2013.01); H01L 29/41766 (2013.01); H01L 29/42368 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A termination structure with multiple embedded potential spreading capacitive structures (TSMEC) and method are disclosed for terminating an adjacent trench MOSFET atop a bulk semiconductor layer (BSL) with bottom drain electrode. The BSL has a proximal bulk semiconductor wall (PBSW) supporting drain-source voltage (DSV) and separating TSMEC from trench MOSFET. The TSMEC has oxide-filled large deep trench (OFLDT) bounded by PBSW and a distal bulk semiconductor wall (DBSW). The OFLDT includes a large deep oxide trench into the BSL and embedded capacitive structures (EBCS) located inside the large deep oxide trench and between PBSW and DBSW for spatially spreading the DSV across them. In one embodiment, the EBCS contains interleaved conductive embedded polycrystalline semiconductor regions (EPSR) and oxide columns (OXC) of the OFLDT, a proximal EPSR next to PBSW is connected to an active upper source region and a distal EPSR next to DBSW is connected to the DBSW.


Find Patent Forward Citations

Loading…