The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2018
Filed:
Sep. 11, 2013
Applicant:
Xilinx, Inc., San Jose, CA (US);
Inventors:
Michael J. Hart, Palo Alto, CA (US);
James Karp, Saratoga, CA (US);
Assignee:
XILINX, INC., San Jose, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/544 (2006.01); H01L 23/58 (2006.01); H01L 23/52 (2006.01); H01L 29/02 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01); H01L 25/075 (2006.01); H01L 21/48 (2006.01); H01L 25/04 (2014.01); H01L 21/66 (2006.01); H01L 23/60 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 29/02 (2013.01); H01L 21/4846 (2013.01); H01L 21/78 (2013.01); H01L 22/32 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/585 (2013.01); H01L 23/60 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/94 (2013.01); H01L 25/042 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/072 (2013.01); H01L 25/0753 (2013.01); H01L 25/115 (2013.01); H01L 25/50 (2013.01); H01L 23/49827 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/752 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/97 (2013.01);
Abstract
A wafer includes a first interposer having a first patterned metal layer and a second interposer having a second patterned metal layer. The wafer includes a metal connection in a scribe region of the wafer that electrically couples the first patterned metal layer of the first interposer with the second patterned metal layer of the second interposer forming a global wafer network. The wafer further includes a probe pad located in the scribe region that is electrically coupled to the global wafer network.