The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Apr. 20, 2015
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Naoyuki Senda, Kanagawa, JP;

Masataka Nakada, Tochigi, JP;

Takayuki Abe, Tochigi, JP;

Koji Kusunoki, Kanagawa, JP;

Hideaki Shishido, Kanagawa, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); G06F 3/044 (2006.01); H01L 51/52 (2006.01); G06F 3/045 (2006.01); G06F 3/041 (2006.01); G06F 15/02 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/323 (2013.01); G06F 3/044 (2013.01); H01L 51/5253 (2013.01); G06F 3/045 (2013.01); G06F 3/0412 (2013.01); G06F 15/0216 (2013.01); H01L 27/322 (2013.01); H01L 51/0097 (2013.01); H01L 51/5284 (2013.01); H01L 2251/5338 (2013.01);
Abstract

A flexible input and output device in which defects due to a crack is reduced. The input and output device includes a first flexible substrate, a second flexible substrate, a first buffer layer, a first crack inhibiting layer, an input device, and a light-emitting element. A first surface of the first flexible substrate faces a second surface of the second flexible substrate. The first buffer layer, the first crack inhibiting layer, and the input device are provided on the first surface side of the first flexible substrate. The first buffer layer includes a region overlapping with the first crack inhibiting layer. The first buffer layer is between the first crack inhibiting layer and the first surface. The input device includes a transistor and a sensor element. The light-emitting element is provided on the second surface side of the second flexible substrate.


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