The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2018
Filed:
Sep. 22, 2016
Northrop Grumman Systems Corporation, Falls Church, VA (US);
Chunbo Zhang, Manhattan Beach, CA (US);
Peter Ngo, Cypress, CA (US);
Gershon Akerling, Culver City, CA (US);
Kevin M. Leong, Los Angeles, CA (US);
Patty Chang-Chien, Redondo Beah, CA (US);
Kelly J. Hennig, Torrance, CA (US);
William R. Deal, Redondo Beach, CA (US);
Northrop Grumman Systems Corporation, Falls Church, VA (US);
Abstract
A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.