The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Nov. 11, 2014
Applicants:

Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;

Waseda University, Tokyo, JP;

Inventors:

Kohei Tatsumi, Tokyo, JP;

Shinji Ishikawa, Tokyo, JP;

Norie Matsubara, Tokyo, JP;

Masamoto Tanaka, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); B23K 35/28 (2006.01); B23K 35/30 (2006.01); C22C 5/06 (2006.01); C22C 5/08 (2006.01); C22C 21/00 (2006.01); B22F 7/08 (2006.01); B23K 35/02 (2006.01); C22C 19/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); B22F 7/08 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/28 (2013.01); B23K 35/30 (2013.01); B23K 35/3033 (2013.01); C22C 5/06 (2013.01); C22C 5/08 (2013.01); C22C 19/00 (2013.01); C22C 21/00 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); B22F 2999/00 (2013.01); H01L 24/27 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03436 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/2741 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29318 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29639 (2013.01); H01L 2224/29644 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/83055 (2013.01); H01L 2224/83065 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/85207 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/15738 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/351 (2013.01); H01L 2924/3512 (2013.01);
Abstract

The present invention can give a joining structure using metal nanoparticles to join the same types or different types of metal where when one surface metal is Al based, the parts are joined through a joining layer containing Ni nanoparticles, whereby a good joining strength is obtained. Further, by using two joining layers () including metal nanoparticles to sandwich metal foil () so as to form a joining layer and joining the same type or different types of surface metals (-) through this joining layer, it is possible to ease the thermal stress due to the difference in amounts of thermal expansion of joined members which have two surface metals.


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