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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9960109 B1

PDFFull Text
Date of Patent:
May. 01, 2018

Filed:

Oct. 27, 2015

Printed circuit board and electronic equipment

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Kunihiko Minegishi, Yokohama, JP;

Assignee:

Canon Kabushiki Kaisha, Tokyo, JP;

Attorney:

Canon U.S.A., Inc., IP Division

Primary Examiner:

Mohammed Shamsuzzaman

Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/498 (2006.01); H01L 27/146 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49894 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15156 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A plurality of lands is formed apart from each other on a surface of a package substrate. Another plurality of lands is formed apart from each other on a surface of a printed wiring board. The surface of the package substrate and the surface of the printed wiring board face each other. The plurality of lands and another plurality of lands are bonded to each other with solder having a height of 30% or less of a diameter of a solder bonding portion at the corresponding land. A ratio of a solder bonded area of at least each of lands, among another plurality of the lands, of which distance value to a corresponding one of the lands is larger than an average distance value between the lands and another lands, to a solder bonded area of the corresponding one of the lands is 56% or more and 81% or less.

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