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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9960101 B1

PDFFull Text
Date of Patent:
May. 01, 2018

Filed:

Jun. 03, 2016

Micro-hoses for integrated circuit and device level cooling

Applicant:

Raytheon Company, Waltham, MA (US);

Inventor:

Jason G. Milne, Hawthorne, CA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:

Renner, Otto, Boisselle & Sklar, LLP

Primary Examiner:

David Vu

Assistant Examiner:

Brandon Fox

Int. Cl.
CPC ...
H02B 1/00 (2006.01); H01L 23/34 (2006.01); H01L 23/473 (2006.01); H01L 23/367 (2006.01); H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01); H01L 23/46 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/4846 (2013.01); H01L 21/4871 (2013.01); H01L 23/3675 (2013.01); H01L 23/66 (2013.01); H01L 24/17 (2013.01); H05K 1/0209 (2013.01); H05K 1/0272 (2013.01); H05K 7/20 (2013.01); H01L 23/433 (2013.01); H01L 23/46 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2918 (2013.01); H01L 2224/29144 (2013.01); H01L 2924/1423 (2013.01);
Abstract

A heat-dissipating device includes at least one heat-dissipating surface and a micro-sized cooling mechanism formed directly on the heat-dissipating surface by an additive manufacturing process. The cooling mechanism includes at least one fluid passage, such as a micro-hose, for carrying a cooling medium from a coolant source directly to the heat-dissipating surface. The cooling mechanism is fluidly sealed to the heat-dissipating surface such that the cooling medium is in thermal contact directly with the heat-dissipating surface.

Find Patent Forward Citations

Milne, Jason. (2018). Micro-hoses for integrated circuit and device level cooling (U.S. Patent No. 9960101). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9960101

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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