The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2018
Filed:
Mar. 14, 2016
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Yo Sakamoto, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;
Abstract
A semiconductor device manufacturing method includes a step of preparing a semiconductor unit, having a first main surface including a heat releasing portion and a second main surface opposite to the first main surface, in which is mounted a semiconductor chip, a step of preparing a cooler having a flat surface, a step of applying a paste including metal nanoparticles to the first main surface of the semiconductor unit or the flat surface of the cooler, a step of bringing the first main surface of the semiconductor unit and the flat surface of the cooler into contact through the paste, and a step of applying a pressurizing force uniform in-plane to the second main surface of the semiconductor unit at the same time as raising the temperature of the paste, thereby sintering the paste and forming a junction layer.