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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9960093 B1

PDFFull Text
Date of Patent:
May. 01, 2018

Filed:

Jan. 27, 2014

Packaging structure, packaging method and template used in packaging method

Applicant:

Tsinghua University, Beijing, CN;

Inventors:

Qian Wang, Beijing, CN;

Lin Tan, Beijing, CN;

Jian Cai, Beijing, CN;

Yu Chen, Beijing, CN;

Assignee:

TSINGHUA UNIVERSITY, Beijing, CN;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Reema Patel

Assistant Examiner:

Syed Gheyas

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/02 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 21/0206 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/293 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

Disclosed are a packaging structure, a packaging method and a template used in packaging method. The packaging structure comprises: a substrate; a chip mounted on the substrate; bonding wires for electrically connecting the substrate to the chip; and a protective layer which is formed on the substrate and is used for covering the chip, the bonding wires and bonding pads connected to the bonding wires, the size of the protective layer being smaller than that of the substrate. The packaging structure, the packaging method and the template used in packaging method can solve the problems in the prior art of the great difficulty in designing a mold chase, a complicated molding process, a high manufacturing cost and a high molding material consumption.

Find Patent Forward Citations

Wang, Qian. (2018). Packaging structure, packaging method and template used in packaging method (U.S. Patent No. 9960093). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9960093

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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