The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2018
Filed:
Apr. 18, 2013
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Makoto Ikemoto, Kitakyushu, JP;
Yasuhiro Kawase, Kitakyushu, JP;
Tomohide Murase, Yokohama, JP;
Makoto Takahashi, Yokkaichi, JP;
Takayoshi Hirai, Yokkaichi, JP;
Iho Kamimura, Yokkaichi, JP;
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Abstract
To provide an interlayer filler composition which, in 3D lamination of semiconductor device chips, forms a highly thermally conductive filling interlayer simultaneously with the bonding of solder bumps or the like and lands between semiconductor device chips, a coating fluid and a process for producing a three-dimensional integrated circuit. An interlayer filler composition for a three-dimensional integrated circuit, which comprises a resin (A) having a melt viscosity at 120° C. of at most 100 Pa·s and a flux (B), the content of the flux (B) being at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A).