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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9960055 B1

PDFFull Text
Date of Patent:
May. 01, 2018

Filed:

Dec. 28, 2017

Manufacturing method of semiconductor device

Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventor:

Haruhiko Harada, Takasaki, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Tokyo, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Ratisha Mehta

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); B29C 45/02 (2006.01); B29C 45/40 (2006.01); B29C 45/14 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); B29C 45/02 (2013.01); B29C 45/14655 (2013.01); B29C 45/4005 (2013.01); H01L 21/561 (2013.01); H01L 24/97 (2013.01); B29K 2105/255 (2013.01); H01L 23/295 (2013.01); H01L 23/3128 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15184 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

In a mold die, a tip-end surface of each push-up pin provided on the rear surface side of a lower die cavity block and a part of the rear surface of the lower die cavity block with which the tip-end surface of each push-up pin is contacted are inclined in such a manner that a distance to a top surface of the lower die cavity block becomes longer towards the pot side where mold resin is supplied. When the lower die cavity block is returned to the initial position, the lower die cavity block is lifted while being slightly moved towards the pot block side. No gap is formed between a side surface of the pot block and a side surface of the lower die cavity block.

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