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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9959950 B1

PDFFull Text
Date of Patent:
May. 01, 2018

Filed:

May. 28, 2013

Thin plate having excellent corrosion resistance, conductivity and formability, and method for manufacturing same

Applicant:

Nakayama Amorphous Co., Ltd., Osaka, JP;

Inventors:

Manabu Kiuchi, Tokyo, JP;

Ryurou Kurahashi, Osaka, JP;

Junji Takehara, Osaka, JP;

Shigeo Kakudou, Osaka, JP;

Tsunehiro Mimura, Osaka, JP;

Assignee:

NAKAYAMA AMORPHOUS CO., LTD., Osaka, JP;

Attorney:

Bacon & Thomas, PLLC

Primary Examiner:

Katie L Hammer

Int. Cl.
CPC ...
H01B 1/18 (2006.01); B22D 23/00 (2006.01); C21D 1/18 (2006.01); C22C 1/00 (2006.01); C22C 45/00 (2006.01); C23C 4/06 (2016.01); C23C 4/10 (2016.01); C23C 4/12 (2016.01); C22C 45/04 (2006.01); C22C 19/05 (2006.01); C22C 1/02 (2006.01); H01M 8/0206 (2016.01); H01M 8/0223 (2016.01); H01M 2/14 (2006.01); H01M 2/16 (2006.01); B22F 3/115 (2006.01); H01M 8/1018 (2016.01); C22C 1/04 (2006.01); C22C 1/10 (2006.01);
U.S. Cl.
CPC ...
H01B 1/18 (2013.01); B22D 23/003 (2013.01); B22F 3/115 (2013.01); C21D 1/18 (2013.01); C22C 1/002 (2013.01); C22C 1/02 (2013.01); C22C 19/058 (2013.01); C22C 45/00 (2013.01); C22C 45/04 (2013.01); C23C 4/06 (2013.01); C23C 4/10 (2013.01); C23C 4/12 (2013.01); H01M 2/145 (2013.01); H01M 2/1646 (2013.01); H01M 8/0206 (2013.01); H01M 8/0223 (2013.01); B22F 2998/10 (2013.01); C22C 1/0433 (2013.01); C22C 1/1036 (2013.01); H01M 2008/1095 (2013.01); H01M 2250/10 (2013.01); H01M 2250/20 (2013.01); H01M 2250/30 (2013.01); Y02B 90/14 (2013.01); Y02B 90/18 (2013.01); Y02P 70/56 (2015.11); Y02T 90/32 (2013.01);
Abstract

[Problem] To prepare a thin plate having excellent corrosion resistance, conductivity, and formability at low cost. [Solution] A thin plate is prepared by an ultraquenching transition control injector with a mixture of a metal powder having corrosion resistance to form a matrix and a powder having conductivity, as a raw material. An obtained thin plate has a conductive material component that exists, without dissolving, in a metal matrix exhibiting corrosion resistance by passivation, thereby having aforementioned characteristics.

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