The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2018
Filed:
May. 22, 2003
Vincenzo Valentino Di Luoffo, Sandy Hook, CT (US);
Craig William Fellenstein, Brookfield, CT (US);
Vincenzo Valentino Di Luoffo, Sandy Hook, CT (US);
Craig William Fellenstein, Brookfield, CT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and apparatus for linking an application service provider to a chipholder during a post issuance operation involving the chipholder. The method and apparatus is implemented by a set of extensible markup language structures for transmitting promotional content and application content information to a chipholder in a smart card system. The smart card system comprises a chip management system (CMS), a distribution server, a security server, an application provider (AP), and a computer system connected by a network. Extensible markup language (SML) is used for post issuance data transactions. Specific XML structures are used to transmit application promotional data (APD) and application content data (ACD) to a CMS for packaging to chipholder during post issuance transactions. The APD and ACD are prepared by the application provider and stored in a marketing file. Responsive to receipt of a request transaction from the CMS by the AP, a determination is made whether an application identifier matches an APD and/or an ACD in the marketing file. If a match is made the APD and/or ACD is included in a response message to the CMS. Upon receipt of the response message, the CMS packages the data for transmittal to the chipholder through the distribution server.