The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2018
Filed:
Jan. 16, 2015
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Katsuei Ichikawa, Tokyo, JP;
Atsuo Soma, Hitachinaka, JP;
Kentarou Miyajima, Hitachinaka, JP;
Kisho Ashida, Hitachinaka, JP;
Makoto Ishii, Hitachi, JP;
Motohiro Sasaki, Hitachi, JP;
Keisuke Iwaishi, Hitachi, JP;
Yuuya Urushihata, Hitachi, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
A rotating body non-contact power-feeding device comprises: a power receiving-side substrate with a power receiving-side circuit component mounted thereat, which is fixed to a rotating shaft supported via a bearing and rotates as one with the rotating shaft; and a power transmitting-side substrate with a power transmitting-side circuit component mounted thereat, which is fixed to a holding unit holding the bearing so that a substrate surface thereof faces opposite a substrate surface of the power receiving-side substrate and is connected with a power source, wherein: a power transmitting-side coil is formed with a conductive pattern so as to achieve a flat-plane spiral pattern with a plurality of turns at a substrate surface facing opposite the power receiving-side substrate and the power transmitting-side circuit component is mounted at another substrate surface, at the power transmitting-side substrate that includes a substrate front surface and a substrate back surface, a power receiving-side coil is formed with a conductive pattern so as to achieve a flat-plane spiral pattern with at least one turn at a substrate surface facing opposite the power transmitting-side substrate and the power receiving-side circuit component is mounted at another substrate surface, at the power receiving-side substrate that includes a substrate front surface and a substrate back surface; and the power transmitting-side coil and the power receiving-side coil are magnetically coupled with each other so as to allow power to be contactlessly fed from the power transmitting-side substrate to the power receiving-side substrate.