The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2018
Filed:
Oct. 28, 2014
Applicants:
Mahle Metal Leve S/a, Jundiai-Sp, BR;
Mahle International Gmbh, Stuttgart, DE;
Inventors:
Paulo R. Vieira De Morais, São Bernardo do Campo, BR;
Sandra Matos Cordeiro, Diadema, BR;
Assignees:
Mahle Metal Leve S/A, , BR;
Mahle International GmbH, , DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16C 33/20 (2006.01); B32B 15/08 (2006.01); B32B 15/082 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 7/12 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01);
U.S. Cl.
CPC ...
F16C 33/203 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/082 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/283 (2013.01); B32B 27/308 (2013.01); B32B 27/322 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); B32B 2264/105 (2013.01); B32B 2307/554 (2013.01); F16C 2204/12 (2013.01); F16C 2204/22 (2013.01); F16C 2208/02 (2013.01); F16C 2240/60 (2013.01); F16C 2360/22 (2013.01);
Abstract
A bearing may include a substrate and a metallic layer disposed in contact with the substrate. An adhesive layer may be disposed in contact with the metallic layer. A supporting layer may be disposed in contact with the adhesive layer. According to an example, a polymer layer may be disposed in contact with the adhesive layer. According to another example, a polymer layer may be disposed in contact with the supporting layer.