The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Jun. 08, 2016
Applicant:

Asahi Glass Company, Limited, Chiyoda-ku, JP;

Inventors:

Takashi Yamamoto, Chiyoda-ku, JP;

Toshiyuki Ishibashi, Chiyoda-ku, JP;

Mitsuhiko Endo, Chiyoda-ku, JP;

Masashi Kasajima, Chiyoda-ku, JP;

Assignee:

Ashi Glass Company, Limited, Chiyoda-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/033 (2006.01); C03B 33/037 (2006.01); B28D 5/00 (2006.01);
U.S. Cl.
CPC ...
C03B 33/033 (2013.01); B28D 5/0011 (2013.01); B28D 5/0052 (2013.01); C03B 33/037 (2013.01);
Abstract

A brittle plate processing method includes having a first portion of a brittle plate supported flat on a flat part of a support member that supports a first surface of the brittle plate, pressing a cutter against a second surface of the brittle plate opposite to the first surface, and forming a scribe line in the second surface of the brittle plate by moving the cutter and the support member relative to each other. In pressing the cutter, the cutter is pressed to a predetermined position on a second portion of the brittle plate other than the first portion. When the cutter is pressed to the predetermined position on the second portion of the brittle plate, the shape of the brittle plate due to bending deformation is defined by a defining part of the support member.


Find Patent Forward Citations

Loading…