The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Nov. 02, 2015
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:

Roger Steadman Booker, Aachen, DE;

Amir Livne, Zichron Ya'Aqov, IL;

Assignee:

KONINKLIJKE PHILIPS N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 6/03 (2006.01); G01T 1/24 (2006.01); A61B 6/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
A61B 6/4241 (2013.01); A61B 6/03 (2013.01); A61B 6/4208 (2013.01); A61B 6/4233 (2013.01); G01T 1/24 (2013.01); G01T 1/243 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 27/14658 (2013.01);
Abstract

The present invention relates to a sensor device for detecting radiation signals. To enable high signal integrity and cost efficiency while maintaining the capability of being four-sidedly buttable, the proposed sensor device comprises a sensor array () comprising a plurality of detectors (-), a sensor element () for converting said received radiation signals (') into a plurality of corresponding electric signals, an interposer element (-) extending laterally between a first side () and a second side (), and an integrated circuit element (-). The interposer element (-) comprises a front surface () facing said sensor element () and a back surface () parallel to said front surface (), wherein a front contact arrangement () is provided on said front surface () for directing said electric signals to a back contact arrangement () provided on said back surface (). The integrated circuit element faces said back surface () and is electrically connected to said back contact arrangement ().


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