The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Feb. 26, 2014
Applicant:
Nichia Corporation, Anan-shi, JP;
Inventors:
Takahiro Oyu, Chiyoda-ku, JP;
Tadaaki Miyata, Yokohama, JP;
Assignee:
NICHIA CORPORATION, Anan-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/60 (2010.01); H05K 13/04 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 33/46 (2010.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 13/046 (2013.01); H01L 24/75 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01); H05K 13/0469 (2013.01); H01L 33/46 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83192 (2013.01); H01L 2933/0066 (2013.01); H05K 3/321 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0195 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/53178 (2015.01);
Abstract
Disclosed is a light emitting device including: a light emitting element including an LED chip and a phosphor layer provided at the light emitting side of the LED chip; and a substrate on which the light emitting element is bonded by an adhesive material. The adhesive material is an anisotropic conductive material.