The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Nov. 28, 2016
Applicant:

Chang Chun Petrochemical Co., Ltd., Taipei, TW;

Inventors:

Yao-Sheng Lai, Taipei, TW;

Kuei-Sen Cheng, Taipei, TW;

Jui-Chang Chou, Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/02 (2006.01); H05K 1/09 (2006.01); H05K 3/30 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H05K 1/09 (2013.01); H05K 3/022 (2013.01); H05K 3/22 (2013.01); H05K 3/303 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/107 (2013.01);
Abstract

The present disclosure relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, printed circuit boards, and electronic devices. The multilayer carrier foil comprises: (a) a copper carrier layer having a release side and a laminate side, the laminate side of carrier layer optionally having nodules; (b) a chromium release layer applied to the copper carrier layer; (c) an intermediate copper layer applied to the chromium release layer; (d) an anti-migration layer applied to the intermediate copper layer of (c); and (e) an ultra-thin copper layer applied to the anti-migration layer of (d). The disclosure further relates to methods of making the multi-layer carrier foil, the core structure, and printed circuit boards.


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