The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Jan. 13, 2012
Koichiro Tanaka, Ibaraki, JP;
Kazuki Kammuri, Ibaraki, JP;
Koichiro Tanaka, Ibaraki, JP;
Kazuki Kammuri, Ibaraki, JP;
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Abstract
A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f×t)/(f×t)=>1 wherein t(mm) is a thickness of the copper foil, f(MPa) is a stress of the copper foil under tensile strain of 4%, t(mm) is a thickness of the resin layer, f(MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1<=33f/(F×T) wherein f(N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 μg/dm. is formed on a surface of the copper foil on which the resin layer is not laminated.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile