The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Oct. 16, 2015
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Hajime Watanabe, Mie, JP;

Yoshifumi Saka, Mie, JP;

Shigeru Sawada, Mie, JP;

Assignees:

AutoNetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/70 (2011.01); H01R 13/03 (2006.01); C25D 3/50 (2006.01); C25D 5/12 (2006.01); C25D 5/50 (2006.01); C25D 3/12 (2006.01); C25D 7/00 (2006.01); C25D 3/30 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); C25D 3/12 (2013.01); C25D 3/30 (2013.01); C25D 3/50 (2013.01); C25D 5/12 (2013.01); C25D 5/505 (2013.01); C25D 7/00 (2013.01); H01R 12/7064 (2013.01); H01R 12/7082 (2013.01);
Abstract

A terminal fitting having a smaller terminal insertion force than before. The terminal fitting includes a backing material made of a metal material and a plating coating covering a surface of the backing material. The plating coating contains a Sn parent phase and Sn—Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn parent phase and the Sn—Pd based particles are present. Further, the number of the Sn—Pd based particles present in the outer surface of the plating coating in a state where only the Sn parent phase is removed is 10 to 400 Sn—Pd based particles per 500 μm.


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