The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Aug. 28, 2015
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Yongjae Lee, Latham, NY (US);

Joseph Alfred Iannotti, Glenville, NY (US);

Christopher Fred Keimel, Schenectady, NY (US);

Christopher James Kapusta, Delanson, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 1/12 (2006.01); H01H 59/00 (2006.01); H01H 49/00 (2006.01); H01P 11/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01P 1/127 (2013.01); B81B 7/007 (2013.01); H01H 49/00 (2013.01); H01H 59/0009 (2013.01); H01P 11/00 (2013.01);
Abstract

A radio frequency (RF) microelectromechanical system (MEMS) package includes a first mounting substrate, a signal line formed on a top surface of the first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and a ground assembly coupled to the first mounting substrate. The ground assembly includes a second mounting substrate, a ground plane formed on a bottom surface of the second mounting substrate, and at least one electrical interconnect extending through a thickness of the second mounting substrate to contact the ground plane, wherein the ground plane is spaced apart from the signal line.


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