The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Sep. 12, 2014
Applicant:

Wistron Corporation, New Taipei, TW;

Inventors:

Yu-Jung Peng, New Taipei, TW;

Hsin-Yu Hsieh, New Taipei, TW;

Yi-Kai Wang, New Taipei, TW;

Assignee:

Wistron Corporation, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 51/05 (2006.01); H01L 27/28 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0018 (2013.01); H01L 51/0023 (2013.01); H01L 51/0541 (2013.01); H01L 51/0554 (2013.01); H01L 27/283 (2013.01);
Abstract

A manufacturing method of an electronic device includes: providing a substrate; forming a source and a drain on the substrate; forming a semiconductor layer on the substrate; forming a first light sensitive material layer on the semiconductor layer; removing a first portion of the first light sensitive material layer by a first exposure and development process and maintaining a second portion of the first light sensitive material layer to serve as a first gate insulation layer; patterning the semiconductor layer to form a channel layer below the first gate insulation layer; forming a second light sensitive material layer on the substrate; removing a third portion of the second light sensitive material layer by a second exposure and development process to expose at least a part of the first gate insulation layer; and forming a first gate on the first gate insulation layer. An electronic device is also provided.


Find Patent Forward Citations

Peng, Yu-Jung. (2018). Electronic device and manufacturing method thereof (U.S. Patent No. 9954171). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9954171

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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