The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Nov. 11, 2014
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Hideki Ishigami, Hachinohe, JP;

Hidefumi Nakamura, Hachinohe, JP;

Yukihiko Shiohara, Hachinohe, JP;

Tetsuya Otsuki, Fujimi, JP;

Tetsuro Miyao, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H01L 41/047 (2006.01); H05K 3/40 (2006.01); H05K 1/03 (2006.01); H03H 9/17 (2006.01); H03H 9/10 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0475 (2013.01); H01L 41/053 (2013.01); H05K 3/4046 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/16152 (2013.01); H03H 9/1021 (2013.01); H03H 9/17 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 3/1216 (2013.01); H05K 3/4061 (2013.01); H05K 2201/10234 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A method of manufacturing a vibrator which includes a method of manufacturing a wiring board includes disposing one granular conductor within each of through holes of a ceramic substrate having the through holes formed therein, supplying a glass paste into the through holes, baking the glass paste, forming an electrode, and disposing a vibrator element and a lid. When a maximum diameter of the granular conductor is set to dand a minimum diameter of each of the through holes is set to d, d/dis preferably equal to or greater than 0.8 and equal to or less than 1.


Find Patent Forward Citations

Loading…