The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Dec. 24, 2015
Applicants:

Aledia, Grenoble, FR;

Commissariat À L'énergie Atomique ET Aux Énergies Alternatives, Paris, FR;

Inventors:

Eric Pourquier, Grenoble, FR;

Philippe Gibert, Saint-Etienne-de-Crossey, FR;

Brigitte Martin, Saint Egreve, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/34 (2010.01); H01L 33/24 (2010.01); H01L 33/44 (2010.01); H01L 33/06 (2010.01); H01L 33/40 (2010.01); H01L 33/08 (2010.01); H01L 31/0224 (2006.01); H01L 31/0216 (2014.01); H01L 31/0352 (2006.01);
U.S. Cl.
CPC ...
H01L 33/24 (2013.01); H01L 31/02161 (2013.01); H01L 31/022408 (2013.01); H01L 31/035227 (2013.01); H01L 33/06 (2013.01); H01L 33/08 (2013.01); H01L 33/405 (2013.01); H01L 33/44 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01);
Abstract

A process for fabricating an electronic device including a substrate and microwires or nanowires resting on the substrate, the process including successive steps of covering the wires with an insulating layer, covering the insulating layer with an opaque layer, depositing a first photoresist layer over the substrate between the wires, etching the first photoresist layer over a first thickness by photolithography, etching the first photoresist layer remaining after the preceding step over a second thickness by plasma etching, etching the portion of the opaque layer not covered by the first photoresist layer remaining after the preceding step, etching the portion of the insulating layer not covered by the opaque layer, removing the first photoresist layer remaining after the preceding step, and removing the opaque layer.


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