The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Jan. 19, 2016
Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Jun Aoki, Tokyo, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 5/374 (2011.01); H04N 5/361 (2011.01); H04N 5/378 (2011.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 27/1469 (2013.01); H01L 27/14605 (2013.01); H01L 27/14623 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H04N 5/361 (2013.01); H04N 5/374 (2013.01); H04N 5/378 (2013.01);
Abstract

A solid-state imaging device includes a first substrate and a second substrate electrically connected to the first substrate. The first substrate includes a first semiconductor layer and one or more first wiring layers. The second substrate includes a second semiconductor layer and one or more second wiring layers. The first photoelectric conversion element overlaps any of the one or more first wiring layers at all positions on the first photoelectric conversion element in a planar view of the first substrate. The second photoelectric conversion element does not overlap any of the one or more first wiring layers at some positions on the second photoelectric conversion element in the planar view of the first substrate.


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