The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Jul. 11, 2016
Applicant:

SK Hynix Inc., Icheon-si Gyeonggi-do, KR;

Inventors:

Gi Guk Park, Icheon-si, KR;

Hyung Ho Cho, Seoul, KR;

Tae Lim Song, Seoul, KR;

Assignee:

SK hynix Inc., Icheon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 25/18 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01); G11C 5/02 (2006.01); G11C 5/04 (2006.01); G11C 5/06 (2006.01); G11C 11/00 (2006.01); H01L 23/00 (2006.01); G11C 14/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); G11C 5/025 (2013.01); G11C 5/04 (2013.01); G11C 5/063 (2013.01); G11C 5/066 (2013.01); G11C 11/005 (2013.01); H01L 23/481 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); G11C 14/0018 (2013.01); H01L 23/3128 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/92 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48147 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/1443 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A semiconductor package may include a DRAM chip mounted on a substrate; an interposer stacked over the DRAM chip and including redistribution structures; a nonvolatile memory chip stacked over the interposer; a memory controller chip mounted on the substrate, and including a control circuit for controlling the nonvolatile memory chip and first pads and second pads electrically coupled to the control circuit; first conductive coupling members configured to electrically couple bonding pads of the nonvolatile memory chip to the redistribution structures; second conductive coupling members configured to electrically couple the redistribution structures to the first pads; and third conductive coupling members configured to electrically couple the second pads to the substrate.


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