The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Mar. 18, 2016
Applicant:
Genesis Photonics Inc., Tainan, TW;
Inventors:
Assignee:
GENESIS PHOTONICS INC., Tainan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 25/065 (2006.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01); H01L 33/10 (2010.01); H01L 23/60 (2006.01); H01L 29/866 (2006.01); H01L 33/48 (2010.01); H01L 27/15 (2006.01); H01L 33/64 (2010.01); H01L 25/075 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/562 (2013.01); H01L 23/60 (2013.01); H01L 27/15 (2013.01); H01L 29/866 (2013.01); H01L 33/10 (2013.01); H01L 33/48 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 33/502 (2013.01); H01L 33/60 (2013.01); H01L 33/642 (2013.01); H01L 33/647 (2013.01); H01L 25/0753 (2013.01); H01L 33/508 (2013.01); H01L 33/56 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49107 (2013.01); H01L 2924/18161 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract
A package substrate is provided. The package substrate includes a base layer having a first surface and a second surface opposite to the first surface, a plurality of through holes penetrating the base layer, a first metal layer disposed on the first surface, and a second metal layer disposed on the second surface. The first metal layer includes a closed-loop trench. A part of the second metal layer is electrically connected to the first metal layer via the through holes. The through holes are positioned at an inner part the closed-loop trench.