The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Jan. 22, 2013
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventor:

Jean Brun, Champagnier, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/02 (2006.01); H05K 13/06 (2006.01); H05K 13/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 24/06 (2013.01); H01L 24/78 (2013.01); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0569 (2013.01); H01L 2224/05601 (2013.01); H01L 2224/0618 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/4847 (2013.01); H01L 2224/4918 (2013.01); H01L 2224/7898 (2013.01); H01L 2224/78611 (2013.01); H01L 2224/78651 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85375 (2013.01); H01L 2224/85801 (2013.01); H01L 2224/85805 (2013.01); H01L 2224/85862 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Method for assembling includes: providing a system to transfer wire element from wire element supply device to wire element storage device; stretching wire element between supply and storage devices by tensioning; providing an individualized reservoir and separated chip elements, each including a connection terminal including a top with free access facing in which chip element is not present; transporting the chip element from reservoir to an assembly area between supply and storage devices in which wire element is tightly stretched in assembly area; fixing electrically conducting wire element to chip element connection terminal in assembly area; and adding electrically insulating material on chip element after latter has been fixed to wire element forming a cover, the addition of material being performed on surface of chip element including connection terminal fixed to wire element to cover at least the connection terminal and portion of wire element at fixing point of latter.


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