The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Apr. 25, 2016
Applicant:

SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;

Inventors:

Dong Uk Lee, Icheon-si, KR;

Kyung Whan Kim, Icheon-si, KR;

Assignee:

SK hynix Inc., Icheon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/02 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); G11C 5/04 (2006.01); G11C 5/06 (2006.01); G11C 7/02 (2006.01); G11C 7/10 (2006.01); G11C 7/22 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); G11C 5/04 (2013.01); G11C 5/063 (2013.01); G11C 7/02 (2013.01); G11C 7/106 (2013.01); G11C 7/1006 (2013.01); G11C 7/1042 (2013.01); G11C 7/1066 (2013.01); G11C 7/1069 (2013.01); G11C 7/222 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01);
Abstract

A semiconductor apparatus includes a plurality of dies. Any one of the dies may be set to a first rank and another of the dies may be set to a second rank. One or more of the first and second ranks may be configured to output any one of an even-numbered byte and an odd-numbered byte through an input/output stage at a timing earlier than the other one, according to a read command.


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