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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9953905 B1

PDFFull Text
Date of Patent:
Apr. 24, 2018

Filed:

Nov. 11, 2014

Semiconductor device

Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventors:

Takuya Kadoguchi, Toyota, JP;

Takanori Kawashima, Anjo, JP;

Assignee:

TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;

Attorney:

Oliff PLC

Primary Examiner:

Laura Menz

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01); H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 23/49 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49582 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/498 (2013.01); H01L 23/49531 (2013.01); H01L 23/49551 (2013.01); H01L 23/49562 (2013.01); H01L 23/528 (2013.01); H01L 24/29 (2013.01); H01L 23/48 (2013.01); H01L 23/49 (2013.01); H01L 24/32 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A semiconductor device includes a substrate, a semiconductor element, a terminal and a solder outflow prevention part. The semiconductor element is fixed on one side of the substrate via a first solder layer. The terminal that is fixed on the one side of the substrate via a second solder layer. The solder outflow prevention part is formed between the semiconductor element and the terminal in the one side of the substrate and is configured to prevent the first solder layer and the second solder layer from outflowing. A distance between the solder outflow prevention part and the semiconductor element is longer than a thickness of the first solder layer.

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