The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Mar. 10, 2015
Applicants:
Stmicroelectronics SA, Montrouge, FR;
Stmicroelectronics (Crolles 2) Sas, Crolles, FR;
Inventors:
Assignees:
STMICROELECTRONICS SA, Montrouge, FR;
STMICROELECTRONICS (CROLLES 2) SAS, Crolles, FR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H05K 7/20 (2006.01); F28D 15/04 (2006.01); H01L 23/427 (2006.01); H01L 23/473 (2006.01); H01L 21/48 (2006.01); H01L 21/3205 (2006.01); H01L 21/3065 (2006.01); H01L 21/02 (2006.01); H01L 23/367 (2006.01); F28D 15/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); F28D 15/04 (2013.01); F28D 15/046 (2013.01); H01L 21/02164 (2013.01); H01L 21/30655 (2013.01); H01L 21/32051 (2013.01); H01L 21/32056 (2013.01); H01L 21/4803 (2013.01); H01L 23/367 (2013.01); H01L 23/473 (2013.01); F28D 2015/0225 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A method of manufacturing a heat pipe, including the steps of: forming in a substrate a cylindrical opening provided with a plurality of ring-shaped recessed radially extending around a central axis of the opening; arranging in the recesses separate ring-shaped strips made of a material catalyzing the growth of carbon nanotubes; and growing carbon nanotubes in the opening from said ring-shaped strips.